简体中文
One-component adhesive for electronic components
Model RoHS
 Halogen Free
 Heat Resistance Adhesion Color Viscosity (X104 cps) Curing Condition Hardness Remark
W-600H（NH） ○ ○ ◎ ◎ black 8-18 120℃X90-120min 80-90D COB bonding
6030H(NH) ○ ○ ◎ ◎ black 90-170 105-115℃X60-90min 90-95D COB bonding
6030H-1(NH) ○ ○ ◎ ◎ black 37-52 105-115℃X60-90min 71-76D COB bonding, components bonding
602H-(HF)黑 ○ ○ ◎ ◎ black 110-150 120℃X60min 75-85D bonding for inductor, coil, and components
602H-4(HF) ○ ○ ◎ ◎ grey 24-40 120℃X90min 88-93D bonding for inductor, coil, and components
602H-6-6黑(HF) ○ ○ ◎ ◎ black 3.6-6.1 120℃X60min 60-70D bonding for inductor, coil, and components
602H-18(HF)中灰色 ○ ○ ◎ ◎ grey 25-35 120℃X90min 85-90D bonding for inductor, coil, and components
6020H(NH) ○ ○ ◎ ◎ grey 28-40 120℃X120min 88-93D bonding for inductor, coil, and components
6020H-4黑(NH) ○ ○ ◎ ◎ black 18-25 120℃X90min 85-90D bonding for inductor, coil, and components
6020H-6-3(NH) ○ ○ ◎ ◎ grey 8-13 120℃X120min 51-56D bonding for inductor, coil, and components
6020H-6-3黑（NH） ○ ○ ◎ ◎ black 7.8-13.5 120℃X120min 58-68D bonding for inductor, coil, and components
6020H-6150(NH) ○ ○ ◎ ◎ grey 8-15 120℃X60min or 150℃X40min 90-95D bonding for inductor, coil, and components
6060RP-9(NH) ○ ○ ◎ ◎ black 1.0-1.7 120℃X30min 90-95D encapsulation for relay
6060RP-CE(NH) ○ ○ ◎ ◎ black 2.5-4.0 120℃X30-60min 90-95D encapsulation for relay
S-9001-6G(NH) ○ ○ ◎ ◎ grey 18-30 120℃X120min 78-83D bonding lead wire and core
S-9001-6G黑(NH) ○ ○ ◎ ◎ black 9-16 120℃X120min 73-78D bonding lead wire and core
S-9001A-6F(NH) ○ ○ ◎ ◎ grey 18.5-33.5 120℃X120min 64-74D bonding lead wire and core
S-9001A-6F(NH)黑色 ○ ○ ◎ ◎ black 19-30 120℃X120min 60-65D bonding lead wire and core


[Note 1] ○：pass, ×：non pass 
RoHS：Pb、Cd、Hg、Cr(VI)、PBBs、PBDEs、DEHP、BBP、DBP、DIBP。
Halogen Free：Cl ≤ 900 ppm，Br ≤ 900 ppm，Cl + Br ＜ 1500 ppm。
[Note 2] ◎ ：excellent, ○：good,  √ ：normal


Tel：Miss Yang 020-61076288

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